[ TutGee.com ] Udemy - Advanced Materials For Electronics Packaging
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- ~Get Your Files Here !/3. ELECTRONICS SUBSTRATE MATERIALS & THEIR FUNCTIONS IN THERMAL MANAGEMENT/1. INTRODUCTION TO SUBSTRATE MATERIALS CERAMIC POLYMERES METALS COMPOSITES.mp4 37.4 MB
- ~Get Your Files Here !/3. ELECTRONICS SUBSTRATE MATERIALS & THEIR FUNCTIONS IN THERMAL MANAGEMENT/3. ELECTRONIC GLASS.mp4 21.3 MB
- ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/3. WHAT IS ELECTRONICS PACKAGING & ITS 2 BROAD CATEGORIES.mp4 20.9 MB
- ~Get Your Files Here !/4. YOUR PCB SUBSTRATE A GUIDE TO MATERIALS/2. TYPES OF CIRCUIT BOARD & ITS APPLICATIONS.mp4 19.9 MB
- ~Get Your Files Here !/3. ELECTRONICS SUBSTRATE MATERIALS & THEIR FUNCTIONS IN THERMAL MANAGEMENT/2. VARIOUS TYPES CERAMIC SUBSTRATE MATERIALS.mp4 19.3 MB
- ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/6. HIERARCHY OF ELECTRONICS PACKAGING.mp4 19.2 MB
- ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/9. CARBON NANO TUBES (CNTs).mp4 17.7 MB
- ~Get Your Files Here !/5. ADVANCED MATERIAL FOR TIM/1. USE OF GELVET OVER CONVENTIONAL TIMs.mp4 17.1 MB
- ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/8. ROLE OF DIAMOND.mp4 14.9 MB
- ~Get Your Files Here !/5. ADVANCED MATERIAL FOR TIM/2. TECHNICAL DETAILS & CERTAIN DRAWBACKS OF GELVET TIMs.mp4 14.7 MB
- ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/7. GOLD-GOLD INTERCONNECTION (GGI).mp4 14.3 MB
- ~Get Your Files Here !/2. PACKAGING CONFIGURATIONS/2. CERAMIC-FLAT-PACK SURFACE-MOUNT GRID-ARRAY-MATRIX CONFIGURATIONS.mp4 14.3 MB
- ~Get Your Files Here !/9. COURSE CLOSING SESSION/1. CONCLUSION.mp4 14.2 MB
- ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/4. WHY DO WE NEED DEVICE PACKAGING COATING .mp4 12.6 MB
- ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/1. INTRODUCTION TO MMCs.mp4 12.0 MB
- ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/2. Al-DIAMOND MMC.mp4 11.8 MB
- ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/7. 3 PACKAGING VARIATIONS CARD DCAM MCML.mp4 11.4 MB
- ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/3. Al-SiC MMC.mp4 11.1 MB
- ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/5. APPLICATIONS OF MATERIALS IN ELECTRONICS PACKAGING.mp4 10.5 MB
- ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/5. Cu-DIAMOND MMC.mp4 9.7 MB
- ~Get Your Files Here !/8. ELECTROMAGNETIC SHIELDING (EMI)/1. ADVANCED MATERIALS USED FOR EMI SHIELDING IN ELECTRONICS.mp4 9.6 MB
- ~Get Your Files Here !/4. YOUR PCB SUBSTRATE A GUIDE TO MATERIALS/1. INTRODUCTION TO PCB.mp4 9.3 MB
- ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/6. Al-GRAPHITE MMC.mp4 9.2 MB
- ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/8. CONCEPT OF CHIP FIRST & CHIP LAST.mp4 8.9 MB
- ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/2. OVERVIEW OF COURSE CONTENTS.mp4 7.3 MB
- ~Get Your Files Here !/2. PACKAGING CONFIGURATIONS/1. SINGLE-IN-LINE DUAL-IN-LINE ZIGZAG-IN-LINE QUAD -IN-LINE CONFIGURATIONS.mp4 6.4 MB
- ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/1. SELF INTRODUCTION.mp4 6.1 MB
- ~Get Your Files Here !/7. PHASE CHANGE MATERIALS/1. MATERIALS USED IN PCM.mp4 6.1 MB
- ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/4. Al-Si MMC.mp4 5.7 MB
- ~Get Your Files Here !/4. YOUR PCB SUBSTRATE A GUIDE TO MATERIALS/3. FR4 PCB BOARD.mp4 5.6 MB
- ~Get Your Files Here !/9. COURSE CLOSING SESSION/2. CLOSING SESSION.mp4 4.6 MB
- ~Get Your Files Here !/8. ELECTROMAGNETIC SHIELDING (EMI)/1.1 RESOURCE.pdf 3.9 MB
- ~Get Your Files Here !/3. ELECTRONICS SUBSTRATE MATERIALS & THEIR FUNCTIONS IN THERMAL MANAGEMENT/1. INTRODUCTION TO SUBSTRATE MATERIALS CERAMIC POLYMERES METALS COMPOSITES.srt 4.2 KB
- ~Get Your Files Here !/2. PACKAGING CONFIGURATIONS/1. SINGLE-IN-LINE DUAL-IN-LINE ZIGZAG-IN-LINE QUAD -IN-LINE CONFIGURATIONS.srt 3.1 KB
- ~Get Your Files Here !/3. ELECTRONICS SUBSTRATE MATERIALS & THEIR FUNCTIONS IN THERMAL MANAGEMENT/3. ELECTRONIC GLASS.srt 2.9 KB
- ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/3. WHAT IS ELECTRONICS PACKAGING & ITS 2 BROAD CATEGORIES.srt 2.7 KB
- ~Get Your Files Here !/7. PHASE CHANGE MATERIALS/1. MATERIALS USED IN PCM.srt 2.5 KB
- ~Get Your Files Here !/4. YOUR PCB SUBSTRATE A GUIDE TO MATERIALS/2. TYPES OF CIRCUIT BOARD & ITS APPLICATIONS.srt 2.4 KB
- ~Get Your Files Here !/3. ELECTRONICS SUBSTRATE MATERIALS & THEIR FUNCTIONS IN THERMAL MANAGEMENT/2. VARIOUS TYPES CERAMIC SUBSTRATE MATERIALS.srt 2.4 KB
- ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/1. INTRODUCTION TO MMCs.srt 2.3 KB
- ~Get Your Files Here !/5. ADVANCED MATERIAL FOR TIM/1. USE OF GELVET OVER CONVENTIONAL TIMs.srt 2.0 KB
- ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/9. CARBON NANO TUBES (CNTs).srt 2.0 KB
- ~Get Your Files Here !/4. YOUR PCB SUBSTRATE A GUIDE TO MATERIALS/3. FR4 PCB BOARD.srt 1.9 KB
- ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/6. HIERARCHY OF ELECTRONICS PACKAGING.srt 1.9 KB
- ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/3. Al-SiC MMC.srt 1.8 KB
- ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/8. ROLE OF DIAMOND.srt 1.8 KB
- ~Get Your Files Here !/2. PACKAGING CONFIGURATIONS/2. CERAMIC-FLAT-PACK SURFACE-MOUNT GRID-ARRAY-MATRIX CONFIGURATIONS.srt 1.7 KB
- ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/2. Al-DIAMOND MMC.srt 1.6 KB
- ~Get Your Files Here !/5. ADVANCED MATERIAL FOR TIM/2. TECHNICAL DETAILS & CERTAIN DRAWBACKS OF GELVET TIMs.srt 1.6 KB
- ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/5. Cu-DIAMOND MMC.srt 1.5 KB
- ~Get Your Files Here !/9. COURSE CLOSING SESSION/1. CONCLUSION.srt 1.5 KB
- ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/2. OVERVIEW OF COURSE CONTENTS.srt 1.4 KB
- ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/7. GOLD-GOLD INTERCONNECTION (GGI).srt 1.3 KB
- ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/7. 3 PACKAGING VARIATIONS CARD DCAM MCML.srt 1.3 KB
- ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/4. WHY DO WE NEED DEVICE PACKAGING COATING .srt 1.3 KB
- ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/5. APPLICATIONS OF MATERIALS IN ELECTRONICS PACKAGING.srt 1.3 KB
- ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/6. Al-GRAPHITE MMC.srt 1.0 KB
- ~Get Your Files Here !/4. YOUR PCB SUBSTRATE A GUIDE TO MATERIALS/1. INTRODUCTION TO PCB.srt 1023 bytes
- ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/4. Al-Si MMC.srt 887 bytes
- ~Get Your Files Here !/8. ELECTROMAGNETIC SHIELDING (EMI)/1. ADVANCED MATERIALS USED FOR EMI SHIELDING IN ELECTRONICS.srt 849 bytes
- ~Get Your Files Here !/9. COURSE CLOSING SESSION/2. CLOSING SESSION.srt 819 bytes
- ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/8. CONCEPT OF CHIP FIRST & CHIP LAST.srt 703 bytes
- ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/1. SELF INTRODUCTION.srt 593 bytes
- ~Get Your Files Here !/Bonus Resources.txt 357 bytes
- Get Bonus Downloads Here.url 176 bytes
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